Remediation for TXRF saturation effects on microdroplet residues from preconcentration methods on semiconductor wafers

Journal of Analytical Atomic Spectrometry

Volumn 20, Issue 7, 2005, Pages 652-658

  Hellin, D ^a,b   Rip, J ^a   Geens, V ^c   Delande, T ^a   Conard, T ^a   De Gendt, S ^a,b   Vinckier, C ^b  

^a IMEC   (Belgium)

^b UNIVERSITY OF LEUVEN   (Belgium)

^c Industriele Hogeschool GROEP T   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

INDUCTIVELY COUPLED PLASMA; MASS SPECTROMETRY; NICKEL; SALTS; SEMICONDUCTING GERMANIUM COMPOUNDS; SILICON WAFERS; THIN FILMS; X RAY SPECTROMETERS;

DROPLET SANDWICH ETCH (DSE); PRECONCENTRATION METHODS; SEMICONDUCTOR WAFERS; TOTAL-REFLECTION X-RAY FLUORESCENCE SPECTROMETRY (TXRF);

SEMICONDUCTOR MATERIALS;

EID: 22544465830     PISSN: 02679477     EISSN: None     Source Type: Journal    
DOI: 10.1039/b502208h     Document Type: Article

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