The inhibition of silver agglomeration by gold activation in silver electroless plating

Journal of the Electrochemical Society

Volumn 152, Issue 6, 2005, Pages

  Cha, Seung Hwan ^a   Koo, Hyo Chol ^a   Kim, Jae Jeong ^a  

^a Seoul National University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

AGGLOMERATION; ANNEALING; CORROSION INHIBITORS; CRYSTAL GROWTH; CRYSTALLOGRAPHY; ELECTRODEPOSITION; GOLD; MICROELECTRONICS; SILVER; THIN FILMS;

GOLD ACTIVATION; SILVER AGGLOMERATION; SILVER ELECTROLESS PLATING; SILVER FILMS;

ELECTROLESS PLATING;

EID: 22544447091     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1905984     Document Type: Article

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