Study and control of the interfacial mass transfer of resist components in 193nm immersion lithography

Journal of Photopolymer Science and Technology

Volumn 18, Issue 5, 2005, Pages 603-613

  Kanna, Shinichi ^a   Inabe, Haruki ^a   Yamamoto, Kei ^a   Tarutani, Shinji ^a   Kanda, Hiromi ^a   Mizutani, Kazuyoshi ^a   Kitada, Kazuyuki ^a   Uno, Seiji ^a   Kawabe, Yasumasa ^a  

^a FUJIFILM CORPORATION   (Japan)

Author keywords

Immersion lithography; Leaching; Mass transfer; Topcoat

Indexed keywords

EID: 22144485554     PISSN: 09149244     EISSN: None     Source Type: Journal    
DOI: 10.2494/photopolymer.18.603     Document Type: Article

References (7)

1. S.Kanna et al., Presentation at the Intl. Sematech Symposium on Immersion & 157nm Lithography Workshop, Aug (2004)
2. W.Hinsberg et al., "Liquid Immersion lithography: evaluation of resist issues," Proc. SPIE, 5376, 21 (2004).
3. S.Kishimura et al., "Resist interaction in 193/157-nm immersion lithography," Proc. SPIE, 5376 , 44 (2004).
4. B.D.Vogt et at., "Measurement of water distribution in thin lithographic films," Proc. SPIE, 5376 , 56 (2004)
5. Ralgh R. Dammel et al., "193nm Immersion Lithography -Taking the Plunge," J. Photopolym. Sci. Technol., 17 ,4 ,587 (2004).
6. M. Yoshida et al., "Development Status of High Performance Materials for Immersion Lithography," J. Photopolym. Sci. Technol., 17 , 4 ,603 (2004).
7. rd.Ed." Reinhold Publishing Co., NewYork (1950)