193 nm immersion lithography - Taking the plunge

Journal of Photopolymer Science and Technology

Volumn 17, Issue 4, 2004, Pages 587-601

  Dammel, Ralph R ^a   Houlihan, Frank M ^a   Sakamuri, Raj ^a   Rentkiewicz, David ^a   Romano, Andrew ^a  

^a CLARIANT CORPORATION   (United States)

Author keywords

193 nm lithography; Antireflecting coating; Flavored water; Immersion lithography

Indexed keywords

POLYMER;

AQUEOUS SOLUTION; CALCULATION; DIFFUSION COEFFICIENT; FILM; GLASS TRANSITION TEMPERATURE; HYDROPHOBICITY; IMAGE ANALYSIS; IMAGING SYSTEM; IMMERSION LITHOGRAPHY; MATERIAL COATING; PARAMETER; PHOTOREACTIVITY; REVIEW; SENSITIVITY AND SPECIFICITY; STRUCTURE ANALYSIS; TECHNIQUE; TECHNOLOGY; THICKNESS; WATER PERMEABILITY;

EID: 3142651441     PISSN: 09149244     EISSN: None     Source Type: Journal    
DOI: 10.2494/photopolymer.17.587     Document Type: Review

References (18)

1. L. Singh, P.J. Ludovice, C.L. Henderson, Thin Solid Films 449, 231-241(2004); Proc. SPIE 5376. (2004), in print; C.L. Soles, J.F. Douglas, E.K. Lin, J.L. Lenhart, R.L. Jones, W.-Li Wu, D.L. Goldfarb and M. Angelopoulos, J. Appl. Phys. 93, 1978-1986 (2003).
2. L. Singh, P.J. Ludovice, C.L. Henderson, Thin Solid Films 449, 231-241(2004); Proc. SPIE 5376. (2004), in print; C.L. Soles, J.F. Douglas, E.K. Lin, J.L. Lenhart, R.L. Jones, W.-Li Wu, D.L. Goldfarb and M. Angelopoulos, J. Appl. Phys. 93, 1978-1986 (2003).
3. L. Singh, P.J. Ludovice, C.L. Henderson, Thin Solid Films 449, 231-241(2004); Proc. SPIE 5376. (2004), in print; C.L. Soles, J.F. Douglas, E.K. Lin, J.L. Lenhart, R.L. Jones, W.-Li Wu, D.L. Goldfarb and M. Angelopoulos, J. Appl. Phys. 93, 1978-1986 (2003).
4. W. Hinsberg, G. Wallraff, C. Larson, B. Davis, V. Deline, S. Raoux, D. Miller, F. Houle, H. John, L. Sundberg, R. Dammel, and W. Conley, Proc. SPIE 5376 (2004), in print.
5. C.M. Berger, C.L. Henderson, Proc. SPIE 5039, 984-995 (2003)
6. J. Crank, "The Mathematics of Diffusion", Oxford University Press, New York 1956 (paperback edition 1999, ISBN 0 19 853411 6), p. 47ff, p. 238.
7. A.C. Jason and G.R. Peters, J. Phys. D6, 512 (1973)
8. Francois Sebillote, Andre Weill, Patrick Paniez, "Cinetique de la diffusion de l'eau dans un film mince de photoresist", Makromol. Chem. 186, 1695-1699 (1985); Yuko Shibayama, Masakatsu Saito, "Influence of Water on Photochemical Reaction of Positive-Type Photoresist", Japanese Journal of Applied Physics 29 (10), 2152-2155 (1990); Lehar, Octavia P.; Spak, Mark A.; Meyer, Stephen; Dammel, Ralph R.; Brodsky, Colin J.; Willson, C. Grant. Resist rehydration during thick film processing. Proceedings of SPIE-The International Society for Optical Engineering (2001), 4345. (Pt. 1, Advances in Resist Technology and Processing XVIII), 463-474.
9. Francois Sebillote, Andre Weill, Patrick Paniez, "Cinetique de la diffusion de l'eau dans un film mince de photoresist", Makromol. Chem. 186, 1695-1699 (1985); Yuko Shibayama, Masakatsu Saito, "Influence of Water on Photochemical Reaction of Positive-Type Photoresist", Japanese Journal of Applied Physics 29 (10), 2152-2155 (1990); Lehar, Octavia P.; Spak, Mark A.; Meyer, Stephen; Dammel, Ralph R.; Brodsky, Colin J.; Willson, C. Grant. Resist rehydration during thick film processing. Proceedings of SPIE-The International Society for Optical Engineering (2001), 4345. (Pt. 1, Advances in Resist Technology and Processing XVIII), 463-474.
10. Francois Sebillote, Andre Weill, Patrick Paniez, "Cinetique de la diffusion de l'eau dans un film mince de photoresist", Makromol. Chem. 186, 1695-1699 (1985); Yuko Shibayama, Masakatsu Saito, "Influence of Water on Photochemical Reaction of Positive-Type Photoresist", Japanese Journal of Applied Physics 29 (10), 2152-2155 (1990); Lehar, Octavia P.; Spak, Mark A.; Meyer, Stephen; Dammel, Ralph R.; Brodsky, Colin J.; Willson, C. Grant. Resist rehydration during thick film processing. Proceedings of SPIE-The International Society for Optical Engineering (2001), 4345. (Pt. 1, Advances in Resist Technology and Processing XVIII), 463-474.
11. J. March, "Advanced Organic Chemistry, Reactions, Mechanisms and Structure, Third Edition, John Wiley & Son 1985, p. 220-221
12. nd Intl. Sematech Immersion Lithography Workshop, Almaden, July 2003; see also ref. 2.
13. J. C. Taylor, C. R. Chambers, S. D. Burns, C. G. Willson, Proc. SPIE 5376, (2004), in print.
14. R. J. LeSuer, F. F. Fan, A. J. Bard, C.G. Willson, C. Taylor, P. Tsiartas, W. Conley, G. Feit, and R. Kunz, Proc. SPIE 5376, (2004), in print.
15. A.K. Raub, S. Brueck, A. Romano et al., Proc. SPIE 5376, (2004), in print.
16. D. G. Flagello, B. Arnold, S. Hansen, M. Dusa, J. Mulkens, P. Jenkins, ASML; R. Garreis, Proc. SPIE 5377, (2004), in print.
17. B.J. Lin, JM3 1(1), 7-12 (2002)
18. nd Intl. Sematech Immersion Lithography Workshop, Almaden, July 2003