Bonding and Deep RIE - A powerful combination for high aspect ratio sensors and actuators

Progress in Biomedical Optics and Imaging - Proceedings of SPIE

Volumn 5715, Issue , 2005, Pages 80-91

  Hiller, K ^a   Kuchler M ^b   Billep, D ^a   Schroter B ^a   Dienel, M ^a   Scheibner, D ^a   Gessner, T ^a,b  

^a CHEMNITZ UNIVERSITY OF TECHNOLOGY   (Germany)

^b FRAUNHOFER IZM   (Germany)

Author keywords

DRIE; HARM MEMS; Inertial sensors; Switchgears; Wafer bonding

Indexed keywords

ACTUATORS; CAPACITANCE; DAMPING; ELECTRIC CONTACTS; REACTIVE ION ETCHING; SENSORS; SINGLE CRYSTALS;

HARM MEMS; INERTIAL SENSORS; SWITCHGEARS; WAFER BONDING;

MICROELECTROMECHANICAL DEVICES;

EID: 21844436599     PISSN: 16057422     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.591509     Document Type: Conference Paper

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