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Volumn 10, Issue 2, 2001, Pages 89-96
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Flip chip on FR-4, ceramics and flex
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Author keywords
[No Author keywords available]
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Indexed keywords
BUILT-IN SELF TEST;
ELECTRIC CONDUCTIVITY;
ELECTRON DEVICE TESTING;
FLIP CHIP DEVICES;
INDUSTRIAL ELECTRONICS;
SUBSTRATES;
ANISOTROPIC CONDUCTIVE FILM;
ANISOTROPIC CONDUCTIVE PASTE;
EUTECTIC SOLDER BUMPS;
FLIP CHIP ON FLEX;
GOLD BUMPS;
ELECTRON DEVICE MANUFACTURE;
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EID: 0034197002
PISSN: 09603131
EISSN: None
Source Type: Journal
DOI: 10.1142/S0960313100000095 Document Type: Article |
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Times cited : (16)
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References (8)
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