New techniques for the design of advanced ultrasonic transducers for wire bonding

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 26, Issue 1, 2003, Pages 37-45

  Parrini, Lorenzo ^a  

^a Oerlikon Assembly Equipment AG   (Switzerland)

Author keywords

FEM simulations; Fine pitch; Ultrasonic transducers; Ultrasonic welding; Ultrasounds; Wire bonder; Wire bonding

Indexed keywords

COMPUTER AIDED DESIGN; COMPUTER SIMULATION; FINITE ELEMENT METHOD; INTERFEROMETRY; OPTIMIZATION; SOLDERING; ULTRASONIC TRANSDUCERS; ULTRASONIC WELDING; ULTRASONICS; VIBRATION CONTROL;

BALL GRID ARRAYS; LASER INTERFEROMETRY; ULTRASONIC FIELD; WIRE BONDER; WIRE BONDING;

ELECTRONICS PACKAGING;

EID: 0037774640     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEPM.2003.813001     Document Type: Article

References (12)

1. R. Millner, Ultraschalltechnik. Weinheim, Germany: Physik-Verlag, 1987.
2. B. Langenecker, "Effect of ultrasound on deformation characteristics of metals," IEEE Trans. Sonics Ultrason., vol. Su-13, p. 1, 1966.
3. G. Harman, Wire Bonding in Microelectronics. New York: McGraw-Hill, 1997.
4. N. Onda, V. Jaecklin, and S. Arsalane, "High frequency wire bonding for ultra fine pitch applications," in Proc. Semicon/Test, Assembly & Packag., Singapore, 1998, p. 208.
5. V. Jaecklin, "Room temperature ball bonding using high ultrasonic frequencies," in Proc. Semicon/Test, Assembly & Packag., Singapore, 1995, p. 208.
6. H. Ramsey and C. Alfaro, "High-frequency enhancement for ambient temperature ball bonding," Semicond. Int., p. 93, Aug. 1997.
7. J. Tsujino, H. Yoshihara, K. Kamimoto, and Y. Osada, "Welding characteristics and temperature rise of high frequency and complex vibration ultrasonic wire bonding," in Proc. Ultrason. Int., Delft, 1997 p. 59.
8. A. Safabaksh, "Unibody ultrasonic transducer," U.S. Patent, 5 469 011, 1995.
9. P. Derks, "The design of ultrasonic resonators with wide output cross sections," Ph.D. thesis, Inst. Technol. Eindhoven, Eindhoven, The Netherlands, 1984.
10. J. Tsujino, H. Yoshihara, K. Kamimoto, and Y. Osada, "High-frequency longitudinal-transverse complex vibration systems for ultrasonic wire bonding," in Proc. IEEE Ultrason. Symp., Toronto, ON, Canada, 1997, p. 849.
11. P. Whelan and M. Whelan, "Ultrasonic transducer and mount," U.S. Patent, 5 364 005, 1994.
12. L. Parrini, "Ultrasonic transducer with a flange for mounting on an ultrasonic welding device, in particular on a wire bonder," European Patent, EP 0 934 794 A1, Aug. 1999.