Tensile fracture behavior of single crystal silicon film having a notch of sub-micron-length

Proceedings of the 2004 International Symposium on Micro-NanoMechatronics and Human Science, MHS2004; The Fourth Symposium 'Micro-NanoMechatronics for and Information-Based Society' The 21st Century

Volumn , Issue , 2004, Pages 57-61

  Li, Xueping ^a   Kasai, Takashi ^a   Ando, Taeko ^a   Shikida, Mitsuhiro ^a   Sato, Kazuo ^a  

^a NAGOYA UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ANISOTROPY; ATOMIC FORCE MICROSCOPY; FRACTURE; FRACTURE TOUGHNESS; ION BEAMS; MICROELECTROMECHANICAL DEVICES; SILICON; SINGLE CRYSTALS; STRAIN; TENSILE TESTING;

DOUBLE CANTILEVER BEAMS (DCB); FOCUSED ION BEAMS (FIC); INDENTATION FRACTURE (IF); SINGLE CRYSTAL SILICON;

THIN FILMS;

EID: 21244489647     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)

1. F. Ericson and J. A. Schweitz, Micromechanical fracture strength of silicon, J. Appl. Phys. 68 (1990) 5840-5844.
2. W. N. Sharpe. Jr., B. Yuan and R. L. Edwards, A new technique for measuring the mechanical properties of thin films, J. Microelectromech. Syst. 6 (1997) 193-199.
3. K. Sato, T. Yoshioka, T. Ando, M. Shikida and T. Kawabata, Tensile testing of silicon film having different crystallographic orientations carried out on a silicon chip, Sens. Actuators A 70 (1998) 148-152.
4. T. Yi, L. Li and C. J. Kim, Microscale material testing of single crystalline silicon: process effects on surface morphology and tensile strength, Sens. Actuators A 83 (2000) 172-178.
5. T. Ando, M. Shikida and K. Sato, Tensile-mode fatigue testing of silicon films as structural material for MEMS, Sens. Actuators. A 93 (2001) 70-75
6. F. Ebrahimi and L. Kalwani, Fracture anisotropy in silicon single crystal, Mater. Sci. Eng. A 268 (1999) 116-126
7. A. M. Fitzgerald, R. H. Dauskardt and T. W. Kenny, Fracture toughness and crack growth phenomena of plasma-etched single crystal silicon, Sensors and Actuators A 83 (2000) 194-199.
8. S. Sundararajan and B. Bhushan, Development of AFM - based techniques to measure mechanical properties of nanoscale structures, Sensors and Actuators A 101 (2002) 338-351.
9. C. P. Chen and M. H. Leipold, Fracture toughness of silicon, Am. Ceram. Soc. bull. 59 (1980) 469-472
10. B. Gross, J. E. Srawley and W. F. Brown. Jr, Stress-intensity factors for a single-edge-notch tension specimen by boundary collocation of a stress function, NASA Tech. Note. D-2395, NASA, 1964.
11. X. Li, H. Kasai, S. Nakao, H. Tanaka, T. Ando, M. Shikita, and K. Sato, A method for measuring the fracture toughness of micrometer-sized single crystal silicon by tensile test, TRANSDUCERS'03, 2003, 444-447.