Numerical analysis of the interfacial contact process in wire thermocompression bonding

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Volumn 19, Issue 2, 1996, Pages 213-222

  Takahashi, Yasuo ^a   Shibamoto, Sigeru ^b   Inoue, Katsunori ^a  

^a OSAKA UNIVERSITY   (Japan)

^b NIPPON STEEL CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; COMPUTER SIMULATION; DEFORMATION; ELECTRIC WIRE; FINITE ELEMENT METHOD; GROWTH (MATERIALS); INTERFACES (MATERIALS); MATHEMATICAL MODELS;

INTERFACIAL CONTACT; LEAD FRAME; METALLIC BOND; THERMOCOMPRESSION BONDING;

ELECTRONICS PACKAGING;

EID: 0030165824     PISSN: 10709886     EISSN: None     Source Type: Journal    
DOI: 10.1109/95.506107     Document Type: Article

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