Gold Ball Bonding on Copper Substrates at Ambient Temperatures

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 5288, Issue , 2003, Pages 130-135

  Lum, I ^a   Noolu, N J ^a   Zhou, Y ^a  

^a UNIVERSITY OF WATERLOO   (Canada)

Author keywords

Au Cu; Ball bonds; Bond shear force; Bondability; Copper; Ultrasonic power

Indexed keywords

BONDING; COPPER; ELECTRIC CONDUCTIVITY; ELECTRIC WIRE; INTEGRATED CIRCUITS; ULTRASONIC APPLICATIONS;

AU-CU; BALL BONDS; BOND SHEAR FORCE; BONDABILITY; ULTRASONIC POWER;

GOLD;

EID: 2342472742     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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