A concept to relate wire bonding parameters to bondability and ball bond reliability

Microelectronics Reliability

Volumn 38, Issue 6-8, 1998, Pages 1287-1291

  Liang, Z N ^a   Kuper, F G ^a   Chen, M S ^a  

^a NXP SEMICONDUCTORS   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; COMPUTATIONAL METHODS; FAILURE ANALYSIS; OPTIMIZATION; RELIABILITY; SHEAR STRESS;

BALL BOND RELIABILITY; REDUCED BONDING PARAMETERS (RBP);

ELECTRIC WIRE;

EID: 0032084052     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(98)00093-6     Document Type: Article

References (9)

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3. D. T. Rooney, J. B. Dixon, K. G. Schurr and M. R. Northrup, "Evaluation of wire bond quality by SEM analysis of ball-shape and visual inspection of intermetallic formation", ISHM'96 Proceedings, 1996 p 432.
4. T. D. Hund and P. V. Plunkett, "Improving thermosonic gold ball bond reliability", IEEE Trans. Comp., Hybrids, and Manuf. Technol., CHMT-8 (1986) 446.
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6. Y. S. Chen and H. Fatemi, "Au wire bonding evaluation by fractional fractorial designed experiment", The International Journal for Hybrid Microelectronics, 10 (1987) 1.
7. W. K. Shu, "Fine Pitch Wire Bonding Development Using Statistical Design of Experiment", IEEE 1995 Proceedings. 45th Electronic Components and Technology Conference, 1995, p 91.
8. M. Sheaffer and L. Levine, "How to Optimize and Control the Wire Bonding Process: Part I", Solid State Technology, , Nov. 1990, p 119.
9. M. Shell-De Guzman and M. Mahaney, "The bond shear test: An application for the reduction of common causes of gold ball bond process variation", IEEE/IRPS, 1992, p 251.