Back-end assembly solution to bare copper bond pad wafers

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4587, Issue , 2001, Pages 511-514

  Lee, C C ^a   Williams, B ^a   Harun, F ^a   Yong, C C ^a   Tan, L C ^a   Downey, S ^a   Harper, P ^a  

^a NONE   (United States)

Author keywords

Assembly; Copper oxidation protection; Copper probe; Copper wafers; Packaging; Wire bonding

Indexed keywords

ASSEMBLY; BONDING; COPPER; ELECTRONICS PACKAGING; INTERMETALLICS;

WIRE BONDING;

OXIDATION;

EID: 0035770441     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

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2. Y.Z. Hu, R. Sharangpani, and S.P. Tay, "Kinetic investigation of copper film oxidation by spectroscopic ellipsometry and relfctometry" J. Vac. Sci. Technol. A 18 (5), Sep/Oct 2000, pp.2527-2532.
3. T. Tran, L. Yong, B. Williams, S. Chen, and A. Chen, "Fine pitch probing and wirebonding and reliability of aluminum capped copper bond pads", Electronic Components & Technology Conference, 2000 Proceedings, 50th, pp. 1674 -1680, 2000.
4. G.G Harman and K.O Leedy, "An experimental model of the microelectronic ultrasonic wire bonding mechanism", Proceedings of the 10th Annual Conference on Reliability Physics 1972 pp.49-56.
5. B. Winchell, "The mechanism of ultrasonic wire bonding", Motorola internal technical report-SRDL Materials Research Laboratory Technical Report no. 73, Feb 1976.
6. M.G. Osborne and N.M. Murdeshwar, "Developing wire bond interconnect solutions for copper", Semicon West 2000, Flip Chip vs Wire Bond Conference, July 2000.
7. th, pp. 416 - 420.