The evaluation of copper migration during the die attach curing and second wire bonding process

IEEE Transactions on Components and Packaging Technologies

Volumn 28, Issue 2, 2005, Pages 337-344

  Lin, T Y ^a   Pecht, Michael G ^b   Das, Diganta ^b   Pan, Jisheng ^c   Wenhui, Zhu ^d  

^a Agere Systems Singapore Pte Ltd   (Singapore)

^b UNIVERSITY OF MARYLAND   (United States)

^c INSTITUTE OF MATERIALS RESEARCH AND ENGINEERING   (Singapore)

^d Cookson Semiconductor Packaging Materials ^*  (Singapore)

Author keywords

Atomic force microscopy (AFM); Design of experiment (DOE); Nonstick on lead (NSOL); Transmission electron microscopy (TEM); X ray photoelectron spectroscopy (XPS)

Indexed keywords

ATOMIC FORCE MICROSCOPY; BONDING; CURING; HEAT TREATMENT; INTEGRATED CIRCUIT MANUFACTURE; LEAD; OPTIMIZATION; SILVER; SURFACE PHENOMENA; TRANSMISSION ELECTRON MICROSCOPY; WIRE; X RAY PHOTOELECTRON SPECTROSCOPY;

COPPER MIGRATION; DESIGN OF EXPERIMENT (DOE); DIE ATTACH CURING; NONSTICK ON LEAD (NSOL); SECOND WIRE BONDING;

COPPER;

EID: 21044449767     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2005.848494     Document Type: Article

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