A physically based lifetime model for stress-induced voiding in interconnects

Journal of Applied Physics

Volumn 97, Issue 11, 2005, Pages

  Zhai, Charlie Jun ^a   Blish, Richard Clark ^a  

^a ADVANCED MICRO DEVICES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

INTERLAYER DIELECTRICS; LIFETIME MODEL; MACROSCOPIC LEVELS; STRESS GRADIENTS;

CREEP; INTEGRATED CIRCUITS; KINEMATICS; MATHEMATICAL MODELS; NUCLEATION; STRAIN; STRESS ANALYSIS; THERMAL EFFECTS; THERMAL EXPANSION;

OPTICAL INTERCONNECTS;

EID: 20544451308     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1922072     Document Type: Article

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