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Volumn 5, Issue 1, 2005, Pages 133-141

Investigation of dielectric/metal bilayer sidewall diffusion barrier for Cu/porous ultra-low-k interconnects

Author keywords

a SiC:H; Cu damascene interconnects; Diffusion barrier; Porous ultra low k; Pseudobreakdown; Time to failure

Indexed keywords

A-SIC:H; CU DAMASCENE INTERCONNECTS; DIFFUSION BARRIERS; POROUS ULTRA-LOW-Κ; PSEUDOBREAKDOWN; TIME-TO-FAILURE;

EID: 20444477164     PISSN: 15304388     EISSN: None     Source Type: Journal    
DOI: 10.1109/TDMR.2005.843833     Document Type: Article
Times cited : (4)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.