Assessment of some integrated cooling mechanisms for an active IPEM

American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD

Volumn 375, Issue 2, 2004, Pages 163-170

  Pang, Y ^a   Scott, E ^a   Van Wyk, J D ^a   Liang, Z ^a  

^a Virginia Polytechnic Institute and State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM NITRIDE; CERAMIC MATERIALS; HEAT RESISTANCE; HEAT SINKS; INTERCONNECTION NETWORKS; METALLIZING; OPTIMIZATION; PACKAGING; POWER ELECTRONICS; THERMAL CONDUCTIVITY; THREE DIMENSIONAL;

EMBEDDED POWER TECHNOLOGY; INTEGRATED POWER ELECTRONICS MODULES (IPEM); THERMAL MANAGEMENT; THERMAL PERFORMANCE;

COOLING;

EID: 20344367525     PISSN: 02725673     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IMECE2004-59342     Document Type: Conference Paper

References (8)

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2. G. Bischak and C. Vogdes, "Thermal Management Design Criteria and Solutions," Proceedings of Northcon/98 Conference, 1998, pp. 128-133.
3. S. J. Rawal, D. M. Barnett, and D. E. Martin, "Thermal Management for Multifunctional Structures," Proceedings of International Conference on Multi-chip Modules and High Density Packaging, 1998, pp. 129-134.
4. Z. Liang, F. C. Lee, J. D. van Wyk, and G. Q. Lu, "Evaluation of Embedded Power Technology for IPEM Packaging Applications," Proceedings of International Symposium on Microelectronics, 2001, pp. 394-398.
5. Y. Pang and E. P. Scott, "Thermal Evaluation of DC/DC and PFC Integrated Power Electronics Modules," Proceedings of Inter-society Conference on Thermal Phenomena in Electronic Systems (I-THERM), 2004, pp. 700-705.
6. Y. Pang and E. P. Scott, "Thermal Characterization and Optimization of Active System IPEM," Proceedings of ASME International Mechanical Engineering Congress & Exposition (IMECE), 2003, paper #41415.
7. Y. Pang, J. Z. Chen, E. P. Scott, and K. A. Thole, "Electrical and Thermal Layout Design and Optimization Considerations for DPS Active IPEM," Proceedings of ASME International Mechanical Engineering Congress & Exposition (IMECE), 2002, paper # 33778.
8. th Edition (New York: Wiley, 1996), pp. 8.