Thermal evaluation of DC/DC and PFC integrated power electronics modules

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 1, Issue , 2004, Pages 700-705

  Pang, Ying Feng ^a   Scott, Elaine P ^a  

^a VIRGINIA POLYTECHNIC INSTITUTE AND STATE UNIVERSITY   (United States)

Author keywords

Detailed modeling; Model validation; Thermal characterization

Indexed keywords

DISTRIBUTED POWER SYSTEMS (DPS); INTEGRATED POWER ELECTRONICS MODULE (IPEM); MODEL VALIDATION; THERMAL CHARACTERIZATION;

DIODES; ELECTRONICS PACKAGING; EMBEDDED SYSTEMS; GATES (TRANSISTOR); MICROPROCESSOR CHIPS; MOSFET DEVICES; SILICON CARBIDE; THERMAL CONDUCTIVITY; THERMOANALYSIS;

DC POWER TRANSMISSION;

EID: 4444232115     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

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