Thermal management for multifunctional structures [spacecraft electronics]

Proceedings - 1998 International Conference on Multichip Modules and High Density Packaging

Volumn 1998-April, Issue , 1998, Pages 129-134

  Rawal, S P ^a   Barnett, D M ^a   Martin, D E ^a  

^a LOCKHEED MARTIN   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FLEXIBLE ELECTRONICS; MICROPROCESSOR CHIPS; MULTICHIP MODULES; RADIATORS; SPACECRAFT; TEMPERATURE CONTROL; VACUUM TECHNOLOGY;

COMPONENT QUALIFICATIONS; COMPONENT TEMPERATURES; HIGH THERMAL CONDUCTIVITY; MULTI-FUNCTIONAL STRUCTURES; SPACECRAFT ELECTRONICS; SPACECRAFT RADIATORS; STRUCTURAL COMPOSITES; THERMAL VACUUM TESTS;

THERMAL CONDUCTIVITY;

EID: 20344377740     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICMCM.1998.670767     Document Type: Conference Paper

References (6)

1. Michael Obal and Janet Sater, "Multifunctional Structures: The Future of Spacecraft Design?," 5th International Conference on Adaptive Structures, Sendai, Japan, December 5-7, 1994.
2. Candida Nunez, "JPL Spacecraft Mass Trends," Jet Propulsion Laboratory Interoffice Memorandum #3132-93-076, February 19, 1993.
3. Brian Muirhead, "Technology Thrust Areas fa-Mass Constrained Spacecraft," AIAA/DARPA Conference on Lightweight Satellite Systems, Naval Postgraduate School, Monterey, CA, August 4-6, 1987.
4. Joel Sercel et al., "Modular and Multifunctional Systems in the New Millennium Program," AIAA-96-0702, 36th Aerospace Sciences Meeting, Reno, NV, January 15-18, 1996.
5. David M. Barnett and Suraj Rawal, "Multifunctional Structures Technology Experiment on Deep Space 1 Mission," 16th Digital and Avionics Systems Conference, pp. 2.3-1 to 2.3-7, 1997.
6. John Chapter, "Honeycomb Panel Spacecraft Radiator with Multichip Module Thermal Analysis and Vacuum Testing," Space Technology and Application International Forum, pp. 801-812, 1997.