Improved planarization for STI with fixed abrasive technology

Solid State Technology

Volumn 43, Issue 6, 2000, Pages 123-124,-126,-128

  Vo, Tuyen ^a,c   Buley, Todd ^a   Gagliardi, John J ^b  

^a Rodel Inc   (United States)

^b 3M COMPANY   (United States)

^c Rodel Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

NITRIDES; OXIDES; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; POLISHING; SURFACE TOPOGRAPHY;

CHEMICAL MECHANICAL PLANARIZATION; HIGH SELECTIVITY SLURRY PROCESSES; SHALLOW TRENCH ISOLATION;

ABRASIVES;

EID: 0343878217     PISSN: 0038111X     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (12)

1. Joseph M. Steigerwald et al., Chemical Mechanical Planarization of Microelectronic Materials, John Wiley & Sons, 1997.
2. S.S. Cooperman, A.I. Nasr, G.J. Grula, "Optimization of a Shallow Trench Isolation Process for Improved Planarization," J. Electochem. Soc., Vol. 142, No. 9, pp. 3180-3185, Sept. 1995.
3. B. Withers, E. Zhao, R. Jairath, S. Hosali, "A Wide Margin CMP and Clean Process for Shallow Trench Isolation Applications," Proc. 3rd Int. CMP-MIC, pp. 319-327, 1998.
4. Ki-Sik Choi et al., "Application of Ceria-based High-Selectivity Slurry to STI CMP for Sub-0.18μm CMOS Technologies,μ Proc. 4th Int. CMP-MIC, pp. 307-313, 1999.
5. J.J. Gagliardi, T. Vo, "STI Polishing with 3M's Fixed Abrasive," 16th International VLSI Multilevel Interconnection Conf., pp. 223-228, 1999.
6. J. Gagliardi, "3M Fixed Abrasive CMP Polishing of Semiconductor Oxide Films," 3M Internal Publication, Sept. 1999.
7. E.F. Funkenbusch, "Slurry-free Oxide CMP Techniques," SEMICON West, Educational Seminar Presentation, 1998.
8. P. Van der Velden, "Chemical Mechanical Polishing Using Fixed Abrasives," SEMI Europa, Educational Seminar Pres/, 1998.
9. A. Sethuraman, W. Koutny, E. Shamble, "Comparison of Defectivity Between Slurry-based and Slurry-free Dielectric CMP," CMPUG, Dec. 3, 1998.
10. E.J. Duwell, G.R. Abrahamson, "Performance of Coated Abrasive Lap Covers for the Grinding and Finishing of Ceramic Surfaces," Third International Grinding Conference, SME Tech. Paper MR88-598, 1988.
11. E.J. Duwell, W.J. McDonald, G.R. Abrahamson, "Effectiveness of Aluminum Oxide and Silicon Carbide in 2-Body and 3-Body Abrasion of Ceramics and Metals," presented at the National Ceramic Soc. Meeting, April 1989.
12. M. Tomozawa, "Oxide CMP Mechanisms," Solid State Technology, pp. 169-175, July 1997.