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Volumn 15, Issue 6, 2005, Pages 1317-1326

Embedded conductor technology for micromachined RF elements

Author keywords

Embedded conductor; Embedded inductor; High aspect ratio MEMS via; High Q inductor; Packaging

Indexed keywords

ASPECT RATIO; CMOS INTEGRATED CIRCUITS; ELECTRIC CONDUCTORS; ELECTRONICS PACKAGING; EPOXY RESINS; METALLIZING; MICROELECTROMECHANICAL DEVICES; MICROMACHINING; MULTILAYERS; SOLENOIDS;

EID: 18744373607     PISSN: 09601317     EISSN: None     Source Type: Journal    
DOI: 10.1088/0960-1317/15/6/025     Document Type: Article
Times cited : (11)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.