Fine pitch bonding technology for chip-to-chip adopted anisotropic conductive film

Proceedings of the IEEE/CPMT International Electronic Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 1997, Pages 51-55

  Ozawa, Susumu ^a   Kitayama, Yuko ^a   Takahashi, Wataru ^a   Tohyama, Hiroshi ^a   Yamashita, Tosimitu ^a  

^a OKI ELECTRIC INDUSTRY CO   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CONDUCTIVE FILMS; CURING; HEAT TREATMENT; LIGHT EMITTING DIODES; PRINTING; SOLDERING;

ANISOTROPIC CONDUCTIVE FILMS (ACF); CHIP TO CHIP DIRECT BONDING; FINE PITCH BONDING;

INTEGRATED CIRCUIT MANUFACTURE;

EID: 0030675513     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)