Stress-induced surface damage and grain boundary characteristics of sputtered and electroplated copper thin films

Acta Materialia

Volumn 52, Issue 8, 2004, Pages 2435-2440

  Park, Hyun ^a   Hwang, Soo Jung ^a   Joo, Young Chang ^a  

^a Seoul National University   (South Korea)

Author keywords

Copper; Grain boundaries; Stress induced surface damage; Thin film

Indexed keywords

ANNEALING; COPPER; DIFFUSION; ELECTROPLATING; GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; MATERIALS SCIENCE; MICROSTRUCTURE; MORPHOLOGY; OXIDATION; SPUTTERING; THERMAL STRESS;

STREE-INDUCED SURFACE DAMAGE; SURFACE AREAS;

THIN FILMS;

EID: 1842842157     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.actamat.2004.01.035     Document Type: Article

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