Evaluation of copper penetration in low-k polymer dielectrics by bias-temperature stress

Materials Research Society Symposium - Proceedings

Volumn 564, Issue , 1999, Pages 535-549

  Loke, Alvin L S ^a,b   Wong, S Simon ^a   Talwalkar, Niranjan A ^a   Wetzel, Jeffrey T ^c   Townsend, Paul H ^d   Tanabe, Tsuneaki ^e   Vrtis, Raymond N ^f   Zussman, Melvin P ^g   Kumar, Devendra ^h  

^a Stanford University   (United States)

^b HEWLETT PACKARD COMPANY   (United States)

^c MOTOROLA INC   (United States)

^d DOW CHEMICAL COMPANY   (United States)

^e ASAHI CHEMICAL INDUSTRY CO   (Japan)

^f Schumacher   (United States)

^g HD MicroSystems   (United States)

^h Novellus Systems   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AROMATIC HYDROCARBONS; BUTENES; CAPACITORS; COPPER; INTEGRATED CIRCUIT MANUFACTURE; PERMITTIVITY; POLYETHERS; POLYIMIDES; SEMICONDUCTING ORGANIC COMPOUNDS; SEMICONDUCTING SILICON; THERMAL STRESS;

POLYMER DIELECTRICS;

DIELECTRIC MATERIALS;

EID: 0033279031     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-564-535     Document Type: Article

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