Development of adhesion promoters to enhance polymer/substrate interface toughness

Proceedings - International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces

Volumn , Issue , 1999, Pages 53-56

  Im, J ^a   Stokich, T ^a   Hetzner, J ^a   Buske, G ^a   Curphy, J ^a   Shaffer, E O ^a   Meyers, G ^a  

^a DOW CHEMICAL COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; ATOMIC FORCE MICROSCOPY; FRACTURE TOUGHNESS; INTERFACES (MATERIALS); SILICON NITRIDE; X RAY PHOTOELECTRON SPECTROSCOPY;

ADHESION ENERGY; ADHESION PERFORMANCE; ADHESION PROMOTER; BCB COATINGS; INTERFACE TOUGHNESS; INTERFACIAL FAILURES; INTERFACIAL FRACTURE ENERGY; LIFT OFFS;

PACKAGING MATERIALS;

EID: 84887957699     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISAPM.1999.757286     Document Type: Conference Paper

References (12)

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