Cure management of benzocyclobutene dielectric for electronic applications

International SAMPE Electronics Conference

Volumn 6, Issue , 1992, Pages 1-12

  Dibbs, M G ^a   Townsend, P H ^a   Stokich, T M ^a   Huber, B S ^a   Mohler, C E ^a   Heistand, R H ^a   Garrou, P E ^a  

^a DOW CHEMICAL COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BUTENES; CURING; DIELECTRIC MATERIALS; ELECTRON DEVICE MANUFACTURE; POLYBUTENES; REACTION KINETICS; SEMICONDUCTING GALLIUM ARSENIDE; SILICONES; STRESSES; SUBSTRATES; THERMAL EFFECTS; THERMOSETS;

BENZOCYCLOBUTENE (BCB); CURE KINETICS; INTERLAYER DIELECTRICS; POLYMER DIELECTRICS; STRESS REDUCTION; SUBSTRATE STRESS; THERMAL CURING;

AROMATIC POLYMERS;

EID: 0027041618     PISSN: None     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (24)