MCM-D technology for a communication application

Proceedings of the 1994 International Conference on Multichip Modules, MCM 1994

Volumn , Issue , 1994, Pages 402-409

  Radlik, W ^a   Plehnert, K ^a   Zellner, M ^a   Achen, A ^b   Heistand, R ^c   Castillo, D ^c   Urscheler, R ^d  

^a SIEMENS AG   (Germany)

^b Dow Deutschland GmbH   (Germany)

^c DOW CHEMICAL COMPANY   (United States)

^d DOW EUROPE GMBH   (Switzerland)

Author keywords

Benzocyclobutene; Cost; MCM D; Photodefinable

Indexed keywords

BUTENES; COSTS; MICROPROCESSOR CHIPS;

BENZOCYCLOBUTENE; COMMUNICATION APPLICATION; DATA-COMMUNICATION; MATERIAL PERFORMANCE; PHOTO-DEFINABLE; PROCESSING STEPS; RELIABLE FORMATIONS; THIN-FILM TECHNOLOGY;

MULTICHIP MODULES;

EID: 33747267047     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICMCM.1994.753582     Document Type: Conference Paper

References (6)

1. E.W. Rutter Jr., E.S. Moyer, R.H. Harris, D.C. Frye, V.L. St. Jore, & F.L. Oaks. "A Photodefinable Benzocyclobutene Resin for the Thin Film Microelectronic Applications" Proceedings of 1st International Conference on Multichip Modules, ISHM/IEPS, Denver, AprU 1992, pp. XX.
2. E.S. Moyer, E.W. Rutter Jr., M.T. Bernius, P.H. Townsend, R.F. Harris, H. Pranjoto, & D.D. Denton. "Photodefinable Benzocyclobutene Formulations for Thin Film Microelectronic Applications: Part H" Proceedings IEPS, Austin, 1992, pp. Xx.
3. E.S. Moyer, G.S. Becker, E.W. Rutter Jr., M. Radier, J.N. Brenner, M.T. Bernius, D. Castillo, A.J.G. Strandjord, R. Heistand, P. Foster, & R.F. Harris. "Photodefinable Benzocyclobutene Formulations for Thin Film Microelectronic Applications. HI. 1 To 20 Micron Patterned Films" Proceedings MRS, 1993.
4. R.H. Heistand II, D.J. Frye, D.C. Burdeaux, J.N. Carr, & P.E. Garrou. "Economic Evaluation of Deposited Dielectric MCM Manufacturing Costs" Proceedings of the International Conference on Multichip Modules, ISHM/IEPS Denver, April 14-16, 1993, pp. 441-450.
5. M.G. Dibbs, P.H. Townsend, T.M. Stokich, B.S. Huber, CE. Möhler, R.H. Heistand, P.E. Garrou, G.M. Adema, M.J. Berry, & I. Turlik. "Cure Management of Benzocyclobutene Dielecüic for Electronic Applications" Proceedings of 6th International SAMPE Electronics Conference, Baltimore, June 22-25, 1992, pp. 1-10.
6. A. Strandjord, R. Heistand, J. Bremmer, P. Garrou, T. Tessier. "A Photosensitive-BCB on Laminate Technology (MCM-LD) Proceedings of ECTC, 44th ECTC Conference, Washington DC, 1994