Influence of self heating in a BiCMOS on SOI technology

ESSCIRC 2004 - Proceedings of the 34th European Solid-State Device Research Conference

Volumn , Issue , 2004, Pages 337-340

  Haralson, Erik ^a   Malm, B Gunnar ^a   Johansson, Ted ^b   Östling, Mikael ^a  

^a ROYAL INSTITUTE OF TECHNOLOGY   (Sweden)

^b Infineon Technologies Nordic AB Sweden   (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

ASPECT RATIO; CAPACITANCE; COMPUTER SIMULATION; HEAT RESISTANCE; HEATING; METALLIZING; POLYSILICON; SILICON ON INSULATOR TECHNOLOGY;

BICMOS TECHNOLOGY; ELECTRO-THERMAL SIMULATIONS; ISOLATION TECHNIQUES; SHALLOW TREND ISOLATION (STI);

CMOS INTEGRATED CIRCUITS;

EID: 17644412931     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)

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