Thermal resistance in Si1-xGex HBTs on bulk-Si and SOI substrates

Proceedings of the IEEE Bipolar/BiCMOS Circuits and Technology Meeting

Volumn , Issue , 2001, Pages 98-101

  Palestri, P ^a   Pacelli, A ^a   Mastrapasqua, M ^a  

^a AGERE SYSTEMS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CMOS INTEGRATED CIRCUITS; COMPUTER SIMULATION; HEAT RESISTANCE; SEMICONDUCTING SILICON COMPOUNDS; SILICON ON INSULATOR TECHNOLOGY; SUBSTRATES;

THERMAL COUPLINGS;

HETEROJUNCTION BIPOLAR TRANSISTORS;

EID: 0035172583     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

1. A low-cost SiGe BiCMOS technology and analog passives for high-performance RF and wide-band applications
2. Scalable small-signal model for BJT self-heating
3. Current gain rolloff in graded-base SiGe heterojunction bipolar transistors
4. Internal thermal feedback in four poles especially in transistors
5. Thermal proprieties of very fast transistors
6. Thermal modelling of thin-film SOI transistors
7. A physics-based dynamic thermal impedance model for vertical bipolar transistors on SOI substrates