Interface formation and adhesion of metals (Cu, Ta, and Ti) and low dielectric constant polymer-like organic thin films deposited by plasma-enhanced chemical vapor deposition using para-xylene precursor

Thin Solid Films

Volumn 377-378, Issue , 2000, Pages 122-128

  Kim, K S ^a   Jang, Y C ^a   Kim, H J ^a   Quan, Y C ^a   Choi, J ^a   Jung, D ^a   Lee, N E ^a  

^a Sungkyunkwan University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; BINDING ENERGY; INTERFACES (MATERIALS); METALLIZING; PERMITTIVITY; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; RUTHERFORD BACKSCATTERING SPECTROSCOPY; THIN FILMS; X RAY PHOTOELECTRON SPECTROSCOPY;

MAGNETICALLY-ENHANCED INDUCTIVELY COUPLED PLASMAS (ME-ICP); PLASMA TREATMENT; POST ANNEALING;

DIELECTRIC FILMS;

EID: 17544393163     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0040-6090(00)01422-X     Document Type: Article

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