Combined ToF-SIMS/XPS Study of Plasma Modification and Metallization of Polyimide

Surface and Interface Analysis

Volumn 27, Issue 7, 1999, Pages 609-617

  Wolany, D ^a   Fladung, T ^a   Duda, L ^a,b   Lee, J W ^a,c   Gantenfort, T ^a   Wiedmann, L ^a   Benninghoven, A ^a  

^a UNIVERSITY OF MÜNSTER   (Germany)

^b TU DORTMUND UNIVERSITY   (Germany)

^c LG   (South Korea)

Author keywords

Copper; Metal deposition; Plasma modification; Polyimide; Polymers; ToF SIMS; XPS

Indexed keywords

EID: 0000914547     PISSN: 01422421     EISSN: None     Source Type: Journal    
DOI: 10.1002/(sici)1096-9918(199907)27:7<609::aid-sia523>3.0.co;2-%23     Document Type: Article

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