Effects of abrasive size and surfactant concentration on the non-Prestonian behavior of ceria slurry in shallow trench isolation chemical mechanical polishing

Japanese Journal of Applied Physics, Part 2: Letters

Volumn 44, Issue 1-7, 2005, Pages

  Kang, Hyun Goo ^a   Katoh, Takeo ^a   Park, Hyung Soon ^b   Pair, Ungyu ^a   Park, Jea Gun ^a  

^a Hanyang University   (South Korea)

^b Hynix Semiconductor Inc   (South Korea)

Author keywords

Abrasive; Cerla slurry; CMP; Concentration; Oxide film; Preston's law; Shallow trench isolation; Size; Surfactant

Indexed keywords

ABRASIVES; ADSORPTION; CERIUM COMPOUNDS; CHEMICAL MECHANICAL POLISHING; CONCENTRATION (PROCESS); MOLECULAR WEIGHT; OXIDES; REACTIVE ION ETCHING; STIFFNESS; SURFACE ACTIVE AGENTS; THIN FILMS; TRENCHING;

CERIA SLURRY; CMP; OXIDE FILMS; PRESTON'S LAW; SHALLOW TRENCH ISOLATION (STI); SIZE;

SLURRIES;

EID: 17444388938     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/JJAP.44.L136     Document Type: Article

References (18)

1. S. Wolf: Silicon Processing for the VLSI Era: Process Integration (Lattice Press, Sunset Beach CA, 1990) Vol. 2, Chap. 13, p. 24.
2. H. S. Park, K. B. Kim, C. K. Hong, U. I. Chung and M. Y. Lee: Jpn. J. Appl. Phys. 37 (1998) 5849.
3. K. Hirai, H. Ohtsuki, T. Ashizawa and Y. Kurata: Hitachi Chemical Tech. Report No. 35 (2000) 17.
4. Y. Tateyama, T. Hirano, T. Ono, N. Miyashita and T. Yoda: Proc. Int. Symp. Chemical Mechanical Planarization IV, Phoenix, AZ, 2000 (Electrochemical Society, Pennington, 2000) p. 297.
5. Y. Homma, T. Furusawa, K. Kusukawa and M. Nagasawa: Proc. CMP-MIC, Santa Clara, CA, 1996 (Institute for Microelectronics Inter-Connection, Tampa, 1996) p. 67.
6. H. G. Kang, T. Katoh, S. J. Kim, H. S. Park, U. Paik and J. G. Park: Jpn. J. Appl. Phys. 43 (2004) L365.
7. T. Katoh, H. G. Kang, U. Paik and J. G. Park: Jpn. J. Appl. Phys. 42 (2003) 1150.
8. H. G. Kang, T. Katoh, M. Y. Lee, H. S. Park, U. Paik and J. G. Park: Jpn. J. Appl. Phys. 43 (2004) 1060.
9. H. Nojo, M. Kodera and R. Nakata: Proc. IEEE idem, San Francisco, CA, 1996 (The Institute of Electrical and Electronics Engineers, Piscataway, 1996) p. 349.
10. T. Katoh, M. S. Kim, Ungyu Paik and J. G. Park: Jpn. J. Appl. Phys. 43 (2002) L217.
11. V. A. Hackley and J. Texter: Ultrasonic and Dielectric Characterization Techniques for Suspended Particulates, eds. V. A. Hackley and U. Paik (American Ceramic Society, Westerville, 1998) p. 191.
12. H. G. Kang, T. Katoh, W. M. Lee, U. Paik and J. G. Park: Jpn. J. Appl. Phys. 43 (2004) 1.
13. T. Katoh, J. G. Park, W. M. Lee, H. Jeon, U. Paik and H. Suga: Jpn. J. Appl. Phys. 41 (2002) L443.
14. S. R. Runnels and L. M. Eyman: J. Electrochem. Soc. 141 (1994) 1698.
15. A. Philipossian and M. Hanazono: Tribology and Fluid Dynamics Characterization of Cerium Oxide Slurries, 2001 (unpublished).
16. M. Miyajima: Syosetsu Handoutai CMP Gijyutsu (Details of Semi-conductor CMP Technology), ed. T. Doy (Kogyo-chosakai, Tokyo, 2000) p. 249 [in Japanese].
17. Y. Moon and D. A. Dornfeld: Ph. D. Dissertation, Dept. Mechanical Eng., Univ. California, Berkeley, CA, 1999.
18. F. W. Preston: J. Soc. Glass Tech. 11 (1927) 247.