Survey of alternatives to tin-lead solder and brominated flame retardants

IEEE International Symposium on Electronics and the Environment

Volumn , Issue , 2001, Pages 309-315

  Murphy, C F ^a   Pitts, G E ^a  

^a UNIVERSITY OF TEXAS AT AUSTIN   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ENVIRONMENTAL IMPACT; FLAME RETARDANTS; LIFE CYCLE; PERFORMANCE; PRINTED CIRCUIT BOARDS;

BROMINATED FLAME RETARDANTS; LIFE CYCLE ANALYSES; TIN-LEAD SOLDER;

SOLDERING ALLOYS;

EID: 0034822860     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (88)

1. Fine pitch surface mount assembly with lead-free, low residue solder paste
2. Wave soldering with lead-free solders
3. Research trends in lead-free soldering in the U.S.: NCMS lead-free solder project
4. Correlation between the structure and the reliability of different lead free solders
5. Pb-free solders based on SnAgCu, SnAgBi, SnAg and SnCu for wave soldering of electronic assemblies
6. Global update on lead-free solders
7. World's first lead free circuit telephone
8. Ecological and economical effects of lead-free soldering
9. Contamination of lead-free solders with copper and lead
10. Metallurgy of low temperature Pb-free solders for electronic assembly
11. Lead-free soldering, state of the art
12. Lead free solders in electronics
13. Development of lead-free solder alloys of the Ge doped Sn-Ag-Bi system
14. The search for lead-free solders
15. Effect of interface microstructure on the mechanical properties of Pb-free hybrid microcircuit solder joints
16. Lead-free solders for electronic packaging and assembly
17. Overview of lead-free solders for electronics and microelectronics
18. New lead-free solders for electronics packaging and assembly
19. Lead finish comparison of lead-free solders versus eutectic solder
20. A novel lead-free solder replacement
21. Lead-free solder BGAs and polymer stud grid arrays
22. Lead-free solder fine pitch stencil printing
23. Lead-free soldering: Legislation, projects, alternatives, outlook
24. Microstructural change and hardness of lead free solder alloys
25. NCMS lead-free electronic interconnect program
26. Lead-free solder project final report
27. Review of current issues in lead-free soldering
28. Environmental issues in electronics and the transition to lead-free soldering
29. A review of the environmental issues in electronics and the challenge of lead-free soldering
30. Assessment of circuit board surface finishes for electronic assembly with lead-free solders
31. NCMS lead-free solder project - Executive summary
32. Alternate interconnect methods using conductive adhesives
33. Developments in lead free soldering
34. Lead-free solder development for automotive electronics packaging applications
35. Lead free solders - A push in the wrong direction?
36. Environmental impact of lead-free solders
37. Lead-free alloys and limitations for surface mount assembly
38. Towards quantifying the effect of lead legislation on electronic product and process design
39. Trend of lead-free soldering in Japan - A report from NEDO project 1999-2000
40. Interface phenomena in lead-free soldering
41. High temperature stability of lead-free soldering interfaces
42. Lead-free solder and micro-jointing
43. Toward defects-free in lead-free micro-soldering
44. Evaluation of Pb-free solders for adaptability to various soldering processes
45. Examining the environmental impact of lead-free soldering alternatives
46. Assessing the environmental implications of lead-free soldering
47. Lead-free product developments in Japan
48. An evaluation of prototype surface mount circuit board assembled with three non-lead bearing solders
49. Reliability studies of surface mount boards manufactured with lead-free solders
50. Development of alternatives to lead-free solder
51. Thermal fatigue damage of quad flat pack leads and Sn-3.5 Ag-X (X=Bi and Cu) solder joints
52. Electroplating of lead-free solder alloys composed of Sn-Bi and Sn-Ag
53. An alternative surface finish for Tin/Lead solders: Pure tin
54. Development of a web-based environmental design tool
55. The green vision in Japan: Why, what, where and when?
56. The green vision in Japan: Why, what, where and when?
57. Polycyanurates - Flame resistant PWBs
58. Electronics goes halogen-free: International driving forces and the availability and potential of halogen-free alternatives
59. Alternatives to halogenated flame retardants in electronic and electrical products: Results from a conceptual study
60. Computer based disassembly planning and design for recycling
61. Proposal of service-oriented products based on the inverse manufacturing concept (1st report) - Concept and business model
62. Toxicology of commercial PBDPOs and TBBPA
63. Brominated flame retardants - An overview of toxicology and industrial aspects
64. Brominated and phosphorus flame retardants - A comparison of health and environmental effects
65. Product design methodology
66. New environmentally conscious flame-retarding plastics for electronic products
67. Integrated product policy (IPP) and eco-product development in the electronics sector
68. A new superior performance halogen-free resin system for high-speed applications and lead-free solder PCB processes
69. Where's eco-design going
70. Toxicological aspects of halogen free flame retardants based on denitrification inhibition tests
71. LCA study of TV sets with VO and HB enclosure material
72. Bromine flame retardants
73. The web-based environmental database
74. Combustion of halogen-free printed wiring boards and analysis of thermal degradation products
75. Development of lead-(Pb) & halogen-free peripheral leaded and PBGA components to meet MSL3 at 260°C peak reflow profile
76. Recycling-oriented product and system development
77. Proposal of service-oriented products based on the inverse manufacturing concept (2nd report) - Reconfigurable design and life cycle evaluation
78. A new halogen-free flame-resistance dielectric with improved toughness for build-up PWBs
79. Halogen free new recyclable cable with low toxic gas emission
80. Examining the environmental impact of lead-free soldering alternatives
81. Bromine flame retardants
82. Proposal for a directive of the European parliament and of the council on waste electrical and electronic equipment
83. Toxicology of commercial PBDPOs and TBBPA
84. Brominated flame retardants - An overview of toxicology and industrial aspects
85. LCA study of TV sets with V0 and HB enclosure material
86. Toxicological aspects of halogen free flame retardants based on denitrification inhibition tests
87. NSF final report on environmentally benign manufacturing
88. Electronics goes halogen-free: International driving forces and the availability and potential of halogen-free alternatives