Effect of substrate preheating on solderability performance as a guideline for assembly process development. Part II: Preheat treatment experiments

Soldering and Surface Mount Technology

Volumn 9, Issue 3, 1997, Pages 23-36

  Vianco, P T ^a   Claghom, A C ^b  

^a SANDIA NATIONAL LABORATORIES   (United States)

^b UNIVERSITY OF OKLAHOMA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FLUXES; HEAT TREATMENT; PRINTED CIRCUIT MANUFACTURE; SUBSTRATES; WETTING;

PREHEAT TREATMENT; SOLDERABILITY;

SOLDERING;

EID: 0031244982     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (8)

1. Lea, C., "Quantitative solderability measurement of electronic components". Soldering and Surface Mount Technology. (October 1990), p. 4.
2. Vianco, P., "An overview of the mesuramentle/wetting balance technique for wettability measurements". The Mesal Science of Journig. TMS, Warrondale, PA, 1992, p. 265.
3. Mayhew, A and Wicks, G., "Solderability by contact angle". Proceedings of InterNEPCON III, 1971, pp. 45-55.
4. Vianco, P. and Claghorn, A., "Effect of substrate preheating on solderability performance as a guadeline for assembly process development". Soldering & Surface Mount Technology 1996, p. 9.
5. Hutchings, C., "Reflew soldering". Soldering & Surface Mount Technology. June 1994, p. 66.
6. Ennis, T., Brady, N., Keane, B. and Dommely, A., "A study of the effects of infra-red reflow profile on solder joint strength and structure". Soldering & Surface Mount Technology. October 1992, p. 12.
7. Artaki, I., Finley, D., Jackson, A., Ray, U. and Viamco, P., "Wave soldering with lead-free solders". Proceedings of Surface Mount International. Surface Mount Technology Association, Edina MN. 1995, p. 195.
8. Artaki, I., Jackson, A. and Viamco, P., "Fine pinch surface mount assembley with lead-free, low resadue solder pasie". Proceedings of Surface Mount International. Surface Mount Technology Association. Edima. MN. 1994, p. 449.