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Volumn , Issue , 2001, Pages 233-235
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Realistic copper interconnect performance with technological constraints
a a a |
Author keywords
[No Author keywords available]
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Indexed keywords
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EID: 85001137468
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/IITC.2001.930070 Document Type: Conference Paper |
Times cited : (12)
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References (5)
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