Evaluating the residual stress in PbTiO3 thin films prepared by a polymeric chemical method

Journal of Physics D: Applied Physics

Volumn 37, Issue 5, 2004, Pages 744-747

  Valim, D ^a   Souza Filho, A G ^a   Freire, P T C ^a   Mendes Filho, J ^a   Guarany, C A ^b   Reis, R N ^b   Araujo E B ^b  

^a FEDERAL UNIVERSITY OF CEARÁ   (Brazil)

^b SÃO PAULO STATE UNIVERSITY UNESP   (Brazil)

Author keywords

[No Author keywords available]

Indexed keywords

CURIE TEMPERATURE; POLYMERIC CHEMICAL METHOD;

FERROELECTRIC THIN FILMS; LIGHT POLARIZATION; METALLORGANIC CHEMICAL VAPOR DEPOSITION; PERMITTIVITY; PHASE TRANSITIONS; PLATINUM; RAMAN SCATTERING; RESIDUAL STRESSES; SILICON; THERMAL EXPANSION; THERMAL STRESS; X RAY DIFFRACTION ANALYSIS;

LEAD COMPOUNDS;

EID: 1642619038     PISSN: 00223727     EISSN: None     Source Type: Journal    
DOI: 10.1088/0022-3727/37/5/015     Document Type: Article

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