Roles of copper mechanical characteristics in electropolishing

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 22, Issue 1, 2004, Pages 116-119

  Chang, Shih Chieh ^a   Shieh, Jia Min ^b   Fang, Jeng Yu ^c   Wang, Ying Lang ^a   Dai, Bau Tong ^b   Feng, Ming Shiann ^c  

^a TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY   (Taiwan)

^b NATIONAL NANO DEVICE LABORATORIES   (Taiwan)

^c NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; COPPER; ELECTROLYTES; ETCHING; GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; HARDNESS; METALLIC FILMS; PHOSPHORIC ACID; TENSILE STRESS; X RAY DIFFRACTION ANALYSIS;

COPPER ELECTROPOLISHING; COPPER FILMS; METALLIC BONDS;

ELECTROLYTIC POLISHING;

EID: 1642397081     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.1633775     Document Type: Conference Paper

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