Stress relaxation of gold/polysilicon layered MEMS microstructures subjected to thermal loading

ASME International Mechanical Engineering Congress and Exposition, Proceedings

Volumn 2, Issue , 2001, Pages 2723-2730

  Zhang, Yanhang ^a   Dunn, Martin L ^a  

^a UCB 450   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COOLING; DEFORMATION; GOLD; INTERFEROMETRY; MICROELECTRONICS; MICROMACHINING; MICROSTRUCTURE; PLATES (STRUCTURAL COMPONENTS); POLYSILICON; STRESS RELAXATION; SURFACE PHENOMENA; THERMAL CYCLING; THERMAL LOAD;

STRESS COMPONENTS; SURFACE MICROMACHINING;

MICROELECTROMECHANICAL DEVICES;

EID: 1542516317     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (19)

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