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Volumn , Issue , 1999, Pages 457-464

A Combined Infrared/Visible Photoemission Microscope

Author keywords

[No Author keywords available]

Indexed keywords

CHARGE COUPLED DEVICES; INFRARED RADIATION; MICROELECTRONICS; MICROPROCESSOR CHIPS; MICROSCOPIC EXAMINATION; PHOTOEMISSION; SEMICONDUCTING CADMIUM TELLURIDE;

EID: 1542360671     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (3)

References (17)
  • 1
    • 0022995102 scopus 로고
    • Imaging and Detection of Current Conduction in Dielectric Films by Emission Microscopy
    • CL Chiang & N Khurana, "Imaging and Detection of Current Conduction in Dielectric Films by Emission Microscopy", Proc. International Electron Devices meeting, 672-675, 1986.
    • (1986) Proc. International Electron Devices Meeting , pp. 672-675
    • Chiang, C.L.1    Khurana, N.2
  • 3
    • 0026173365 scopus 로고
    • Extended (1.1-2.9 eV) Hot carrier Induced Photon Emission in n-channel Si MOSFETs
    • M Lanzoni and W Sangiorgi, "Extended (1.1-2.9 eV) Hot carrier Induced Photon Emission in n-channel Si MOSFETs", IEEE Electron Device Letters 12(6) 341-3, 1991.
    • (1991) IEEE Electron Device Letters , vol.12 , Issue.6 , pp. 341-343
    • Lanzoni, M.1    Sangiorgi, W.2
  • 4
    • 0027558842 scopus 로고
    • On the Bremmstrahlung Origin of Hot Carrier Induced Photons in Silicon Devices
    • A L Lacaita, F Zappa, S Bigliardi & M Manfredi, "On the Bremmstrahlung Origin of Hot Carrier Induced Photons in Silicon Devices", IEEE Trans Electron Devices, 40(3), 577-82, 1993.
    • (1993) IEEE Trans Electron Devices , vol.40 , Issue.3 , pp. 577-582
    • Lacaita, A.L.1    Zappa, F.2    Bigliardi, S.3    Manfredi, M.4
  • 5
    • 0031335141 scopus 로고    scopus 로고
    • Infrared imaging and backside failure analysis techniques on multilayer CMOS technology
    • S Chen, B Shinseki, C Barutha & T Kha, "Infrared imaging and backside failure analysis techniques on multilayer CMOS technology", Proceedings of the 6th IPFA 17-20, 1997.
    • (1997) Proceedings of the 6th IPFA , pp. 17-20
    • Chen, S.1    Shinseki, B.2    Barutha, C.3    Kha, T.4
  • 13
    • 0033284708 scopus 로고    scopus 로고
    • Characterisation and Application of highly Sensitive Infr-Red Emission Microscopy for Microprocessor Backside Failure Analysis
    • Loh T H, Yee W M, Chew Y Y, "Characterisation and Application of highly Sensitive Infr-Red Emission Microscopy for Microprocessor Backside Failure Analysis", Proceedings of the 7th IPFA, 108-112, 1999.
    • (1999) Proceedings of the 7th IPFA , pp. 108-112
    • Loh, T.H.1    Yee, W.M.2    Chew, Y.Y.3
  • 16
    • 0026686001 scopus 로고
    • Silicon Temperature Measurement by Infrared Absorption: Fundamental Processes and Doping Effects
    • J C Sturm & C M Reeves, "Silicon Temperature Measurement by Infrared Absorption: Fundamental Processes and Doping Effects", IEEE Trans. Electron Devices, 39(1), 81-88, 1992.
    • (1992) IEEE Trans. Electron Devices , vol.39 , Issue.1 , pp. 81-88
    • Sturm, J.C.1    Reeves, C.M.2
  • 17
    • 0032277461 scopus 로고    scopus 로고
    • Detecting Underfill Delamination and Cracks in Flip Chip on Board Assemblies using Infrared Microscopy
    • J Lu, A Trigg, J Wu & T Chai, "Detecting Underfill Delamination and Cracks in Flip Chip on Board Assemblies using Infrared Microscopy", International Journal of Microcircuits and Electronic packaging, 21(3) 231 - 235, 1998.
    • (1998) International Journal of Microcircuits and Electronic Packaging , vol.21 , Issue.3 , pp. 231-235
    • Lu, J.1    Trigg, A.2    Wu, J.3    Chai, T.4


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.