Characterization and application of highly sensitive infra-red emission microscopy for microprocessor backside failure analysis

Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA

Volumn , Issue , 1999, Pages 108-112

  Hoe, Loh Ter ^a   Mun, Yee Wai ^a   Yan, Chew Yin ^a  

^a Intel Technology Malaysia Sdn Bhd   (Malaysia)

Author keywords

[No Author keywords available]

Indexed keywords

FAILURE ANALYSIS; INFRARED RADIATION; INTEGRATED CIRCUIT TESTING; LIGHT EMISSION; OPTICAL MICROSCOPY; SEMICONDUCTING CADMIUM TELLURIDE;

INFRARED EMISSION MICROSCOPY (IREM); MERCURY CADMIUM TELLURIDE;

MICROPROCESSOR CHIPS;

EID: 0033284708     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (2)