Giga-hertz electrical characteristics of Flip-chip BGA package exceeding 2,000pin counts

Proceedings - Electronic Components and Technology Conference

Volumn 1, Issue , 2004, Pages 334-341

  Nakagawa, Kazuyuki ^a   Watanabe, Masaki ^a   Baba, Shinji ^a   Yamagishi, Keitaro ^b   Sasaki, Yuuichi ^b   Kamiyama, Tomoyuki ^b   Kimura, Michitaka ^a  

^a RENESAS TECHNOLOGY CORP   (Japan)

^b MITSUBISHI ELECTRIC CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

APPLICATION SPECIFIC INTEGRATED CIRCUITS; COMPUTER SIMULATION; ELECTRONICS PACKAGING; JITTER; RANDOM PROCESSES; ROUTERS; SIGNAL DETECTION;

ACTIVATION FREQUENCIES; FLIP-CHIP BGA; HEAT SPREADER; SILICONE RESIN; UNDERFILL RESIN;

FLIP CHIP DEVICES;

EID: 10444248083     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. K. Nakagawa, M. Watanabe, S. Baba, K. Yamagishi, Y. Sasaki, M. Namatame and M. Kimura, "High Speed Trasmission and Power Ground Characteritics of FC-BGA Package Over 2,000pin Counts" 12th Micro Electronics Symposium, Osaka, Japan, pp. 255-258, 2002.
2. K. Nakagawa, M. Watanabe, S. Baba, K. Yamagishi, Y. Sasaki, M. Namatame and M. Kimura, "High Speed Trasmission and Power Ground Characteritics of Flip-chip BGA Package Over 2,000pin Counts", Technical Report of IEICE, CPM2002-160 ICD2002-205, Tokyo, Japan, pp. 47-51, 2003.
3. S. Baba, Q. Wu, E. Hayashi, M. Watanabe, H. Matsushima, Y. Tomita and Y. Takemoto, "Flip-Chip BGA Applied High-Density Organic Substrate" Proc. 49th ECTC, pp. 243-249, 1999.
4. H. Matsushima, S. Baba, Y. Tomita, M. Watanabe, E. Hayashi and Y. Takemoto, "Thermally Enhanced Flip-chip BGA with Organic Substrate" Proc. 48th ECTC, pp. 685-691, 1998.
5. Y. Tomita, Q. Wu, M. Watanabe, E. Hayashi, M. Okada, Y. Noguchi, H. Matsushima, S. Baba and Y. Takemoto, "Advanced Packaging Technologies for High-pin-count Organic Flip-chip BGA" Proc. The 3rd IEMT/IMC Symposium Apr 21-23, 1999.