Thermal analysis for multichip module using computational fluid dynamic simulation

Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'04

Volumn , Issue , 2004, Pages 326-330

  Cheng, Yingjun ^a   Zhu, Wenjie ^b   Zhu, Rui ^a   Xu, Gaowei ^a   Luo, Le ^a  

^a SHANGHAI INSTITUTE OF MICROSYSTEM AND INFORMATION TECHNOLOGY   (China)

^b JIANGNAN INSTITUTE OF COMPUTING TECHNOLOGY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTATIONAL FLUID DYNAMICS; COMPUTER SIMULATION; FINITE ELEMENT METHOD; HEAT FLUX; HEAT LOSSES; INCOMPRESSIBLE FLOW; MATHEMATICAL MODELS; MULTICHIP MODULES; THERMAL CONDUCTIVITY; THERMOANALYSIS;

MULTICHIP PACKAGES; PACKAGE GEOMETRY; SILICON MULTICHIPS; SOLDER BALL PATTERNS;

ELECTRONICS PACKAGING;

EID: 14844297389     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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