Solid model based preprocessor to cfd code for applications to electronic cooling systems

Journal of Electronic Packaging, Transactions of the ASME

Volumn 119, Issue 2, 1997, Pages 138-143

  Agonafer, D ^a   Vimba, A ^a  

^a IBMS/390 Division   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BOUNDARY CONDITIONS; COMPUTATIONAL FLUID DYNAMICS; COMPUTER AIDED DESIGN; COMPUTER SIMULATION; COOLING; THREE DIMENSIONAL COMPUTER GRAPHICS; TURBULENT FLOW;

ELECTRONIC COOLING SYSTEMS; SOLID MODELS;

ELECTRONICS PACKAGING;

EID: 0031165866     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2792220     Document Type: Article

References (12)

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2. Agonafer, D., and Simons, R. E., 1986, “Optimization Trade-Off Analyses of a Thermal Conduction Module Package Using CAEDS,” ASME HTD, Vol. 57, pp. 231-237.
3. Asako, Y., and Faghri, M., 1989, “Three-Dimensional Heat Transfer Analysis of Arrays of Heated Square Blocks,” International Journal of Heat and Mass Transfer, Vol. 32, No. 2, pp. 395-405.
4. Chu, R. C., Hwang, U. P., and Simons, R. E., 1982, “Conduction Cooling for an LSI Package: A One-Dimensional Approach,” IBM Journal of Research and Development, Vol. 26, No. 1, pp. 45-54.
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6. Lehmann, G. L., and Wirtz, R. A., 1985, “The Effect of Variations in Slream-Wise Spacing and Length on Convection From Surface Mounted Rectangular Components,” ASME HTD, Vol. 48, pp. 39-47.
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8. Moffat, R. J., Arvizu, A., and Ortega, A., 1985, “Cooling Electronic Components: Forced Convection With an Air-Cooled Array,” ASME HTD Vol. 48, pp. 17-28.
9. Patankar, S. V., 1980, Numerical Heat Transfer and Fluid Flow, Hemisphere Publishing Corporation, New York, NY.
10. Seely, J.H., and Chu, R. C., 1972, Heat Transfer in Electronic Equipment, Marcel Dekker, Inc., New York, NY.
11. Sparrow, E. M., Yanezmoreno, A. A., and Otis, Jr., D. R., 1982, “Heat Transfer and Pressure Drop Characteristics of Arrays of Rectangular Modules Encountered in Electronic Equipment,” International Journal of Heat Mass Transfer, Vol. 22, No. 7, pp. 961-973.
12. Sparrow, E. M., Yanezmoreno, A. A., and Otis, Jr., D. R., 1984, “Convective Heat Transfer Response to Height Differences in an Array of Block-Like Electronic Components,” International Journal of Heat Mass Transfer, Vol. 27, No. 3, pp. 469-473