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Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA

Volumn , Issue , 2004, Pages 71-74

Copper corrosion issue and analysis on copper damascene process

(5) Song, Z G a Neo, S P a Oh, C K a Redkar, S a Lee, Y P a

a CHARTERED SEMICONDUCTOR MANUFACTURING LTD (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

CORROSIVE SLURRIES; METAL LINES; NMOS CONTACTS; PHOTO ASSISTANT COPPER CORROSION (PACC);

CHEMICAL MECHANICAL POLISHING; CORROSION; DRY ETCHING; ELECTRIC CONDUCTIVITY; ELECTROCHEMISTRY; FAILURE ANALYSIS; GALVANIZING; METALLIZING; OXIDATION; PHOTONS; RELIABILITY; SEMICONDUCTOR DEVICES; TRANSMISSION ELECTRON MICROSCOPY; VOLTAGE CONTROL;

COPPER;

EID: 14844295473 PISSN: None EISSN: None Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper

Times cited : (3)

References (8)

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