The investigation of galvanic corrosion in post-copper-CMP cleaning

Proceedings of the IEEE 2000 International Interconnect Technology Conference, IITC 2000

Volumn , Issue , 2000, Pages 256-258

  Chen, H C ^a   Yang, M S ^a   Wu, J Y ^a   Wang, V ^a  

^a UNITED MICROELECTRONICS CORPORATION   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL MECHANICAL POLISHING; COPPER; CORROSION; SOLVENTS;

COPPER LINES; CORROSION BEHAVIOR; DEVICE WAFERS; GALVANIC CORROSION; LIGHT-INDUCED; SOLVENT CLEANING; STAND -ALONE; STRUCTURAL TESTS;

CLEANING;

EID: 84962815834     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IITC.2000.854341     Document Type: Conference Paper

References (4)

1. K. David, M. Bohr, "Interconnect scaling - future trends and requirements", SEMI Symposium on Chip Interconnection Digest of Technical Papers, July, 1996, pp. 1-17.
2. C. Ryu, K. W. Kwon, A. L. S. Loke, V. M. Dubin, R. A. Kavari, G. W. Ray, and S. S. Wong, "Electromigration of submicron Damascene copper interconnects", 1998 Symp. on VLSI Technology, June 11, 1998, pp. 156-157.
3. C. Ryu, A. L. S. Loke, T. Nogami, and S. S. Wong, "Effect of texture on the electromigration of CVD copper", IEEE Int. Reliability Phys. Symp. Proc., April, 1997, pp. 201-205.
4. nd IITC, May, 1999, pp. 65-67.