Residual stress development during the composite patch bonding process: Measurement and modeling

Composites - Part A: Applied Science and Manufacturing

Volumn 33, Issue 2, 2002, Pages 277-288

  Djokic, D ^a   Johnston, A ^b   Rogers, A ^a   Lee Sullivan, P ^a   Mrad, N ^b  

^a UNIVERSITY OF NEW BRUNSWICK   (Canada)

^b NATIONAL RESEARCH COUNCIL CANADA   (Canada)

Author keywords

A. Carbon fibre; B. Residual internal stress; C. Analytical modelling; D. Process monitoring; Patch repair processing

Indexed keywords

ADHESIVES; BONDING; CARBON FIBERS; CURING; GLASS TRANSITION; RESIDUAL STRESSES;

PATCH REPAIR PROCESSING;

COMPOSITE MATERIALS;

EID: 0035242283     PISSN: 1359835X     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1359-835X(01)00083-5     Document Type: Article

References (13)

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5. Micro-measurements. Instruction bulletin B-129
6. An investigation of the development of residual thermal strains in composite patch repair of metallic structures
7. Kinetics and thermal characterization of thermoset cure
8. Cure cycle optimization for the reduction of process-induced residual stresses in composite materials
9. Relationship between isothermal and dynamic cure of thermosets via the isoconversion representation