An optical method for measuring the two-dimensional surface curvatures of electronic packages during thermal cycling

Journal of Electronic Packaging

Volumn 123, Issue 3, 2001, Pages 196-199

  Du, Yong ^a   Zhao, Jie Hua ^a   Ho, Paul ^a  

^a UNIVERSITY OF TEXAS AT AUSTIN   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0040749008     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1347987     Document Type: Article

References (6)

1. Chua,. Teo Yong, et al., 1995, "BGA Package Analysis using FEA," SEMICON/West.
2. Kuan, Lee Choon, and Cheng, Yan Ji, 1998, "Warpage in Plastic IC Packages," 48th ECTC.
3. Miyake, Kiyoshi, and Saitou, Kiyoshi, 1997, "Analysis of Warpage of Surface Mount Devices," JSME The 10th Computer Mechanics Conf.
4. Finot, M., Blech, I. A., Suresh, S., and Fujimoto, H., 1997 "Large Deformation and Geometric Instability of Substrate with Thin-film Deposits," J. Appl. Phys., 81, pp. 3457-3464.
5. Timoshenko, S., 1940, Theory of Plates and Shells, Chapter II, McGraw-Hill, New York and London.
6. Zhao, Jie-Hua, Dai, Xiang, and Ho, Paul, 1998, "Analysis and Modeling Verification for Thermal-Mechanical Deformation in Flip-Chip Packages," 48th ECTC.