Linear fracture mechanics analysis on growth of interfacial delamination in LSI plastic packages under temperature cyclic loading

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Volumn 21, Issue 4, 1998, Pages 422-427

  Saitoh, Takehiro ^a   Matsuyama, Hidehito ^a   Toya, Masayuki ^b  

^a NEC CORPORATION   (Japan)

^b KAGOSHIMA UNIVERSITY   (Japan)

Author keywords

Coefficient of thermal expansion; Delamination; Die bonding material; Encapsulant resin; Finite element method; Fracture mechanics; Leadframe; LSI; Plastic package; Stress intensity factor; Temperature cyclic loading; Thermal stress; Young's modulus

Indexed keywords

DELAMINATION; ELASTIC MODULI; FINITE ELEMENT METHOD; FRACTURE MECHANICS; INTERFACES (MATERIALS); LSI CIRCUITS; STRESS INTENSITY FACTORS; THERMAL CYCLING; THERMAL EXPANSION; THERMAL STRESS; THERMOELASTICITY;

DIE BONDING MATERIALS; ENCAPSULANT RESINS; LEADFRAME MATERIALS;

ELECTRONICS PACKAGING;

EID: 0032202259     PISSN: 10709894     EISSN: None     Source Type: Journal    
DOI: 10.1109/96.730427     Document Type: Article

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