Modeling of viscoelastic effects on interfacial delamination in IC packages

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2000, Pages 1326-1331

  Xiong, Z ^a   Tay, A A O ^a  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

CRACKS; DELAMINATION; ELASTIC MODULI; ENCAPSULATION; EPOXY RESINS; FINITE ELEMENT METHOD; FRACTURE MECHANICS; INTEGRATED CIRCUIT MANUFACTURE; INTERFACES (MATERIALS); MATHEMATICAL MODELS; PLASTICS MOLDING; VISCOELASTICITY;

EPOXY MOLDING; INITIAL CRACK; INTERFACIAL DELAMINATION;

ELECTRONICS PACKAGING;

EID: 0034476181     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (14)