Synthesis and characterization of water-soluble polymeric adhesion promoter for epoxy resin/copper joints

Journal of Applied Polymer Science

Volumn 85, Issue 10, 2002, Pages 2202-2210

  Song, S M ^a   Cho, K ^b   Park, C E ^b   Yun, H K ^c   Oh, S Y ^c  

^a Kolon Industries Inc   (South Korea)

^b Pohang University of Science and Technology (POSTECH)   (South Korea)

^c SAMSUNG Electronics   (South Korea)

Author keywords

Adhesion strength; Interfaces; Metal polymer complexes; Thermosets; Water soluble polymers

Indexed keywords

ACRYLICS; ADHESION; CARBOXYLIC ACIDS; CHARACTERIZATION; COPPER ALLOYS; INTERFACES (MATERIALS); SOLUBILITY; SYNTHESIS (CHEMICAL); THERMOSETS;

ADHESION STRENGTH; AMINOPHENOL; BENZOTRIAZOLE CARBOXYLIC ACID; EPOXY MOLDING COMPOUND; PHENOLYLBENZOTRIAZOLE CARBOXYLIC AMIDE;

EPOXY RESINS;

ADHESION; COPPER; EPOXY RESIN; JOINT; POLYMER; SYNTHESIS;

EID: 0037031783     PISSN: 00218995     EISSN: None     Source Type: Journal    
DOI: 10.1002/app.10837     Document Type: Article

References (16)