Zincate-free, electroless nickel deposition on aluminum bond pads

Journal of the Electrochemical Society

Volumn 152, Issue 1, 2005, Pages

  Rohan, James F ^a   Murphy, Patricia A ^a,b   Barrett, John ^a,c  

^a UNIVERSITY COLLEGE CORK   (Ireland)

^b Intel Ireland Ltd   (Ireland)

^c Munster Technological University   (Ireland)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; CHEMICAL BONDS; COMPOSITION; ELECTROLESS PLATING; ENERGY DISPERSIVE SPECTROSCOPY; MORPHOLOGY; OPTIMIZATION; SCANNING ELECTRON MICROSCOPY;

ALKALINE SOLUTIONS; ALUMINUM BOND PADS; MICROELECTRONIC APPLICATIONS; ZINCATE;

NICKEL;

EID: 12744261373     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1836131     Document Type: Article

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